Wafer Sensor Master

Precision Wireless Measurement Device

AGMD(Advanced Gap Measurement Device)
 
컨텐츠 이미지
 
“Wafer Sensor Master” by SESO are Bluetooth enabled, wafer-shaped precision measurement devices that measure Vibration, Level,
and Gap in real-time, with measurements made in the wafer moving position.
Optimized equipment set-up is achieved by checking robot and
wafer process positions inside the equipment, and supports optimized set-up. It’s now possible to check and verify the progress of PM
and BM in real time!
 
AGMD (Advanced Gap Measurement Device) is a wafer-shaped precision gap measurement sensor that measures the gap between
the pedestal (heater) and the shower head (conductive target) inside the chamber through the inductive reactance (eddy current)
method.
The gap data is measured in real time, and now possible to check the degree of parallelism between the pedestal and the shower head.
- The AGMD utilizes a hard anodized housing with high-strength aluminum- this prevents scratches and particles from the friction
with the pedestal.
The AGMD can measure within a range of 13mm to 20mm, and incorporates an Inductive Reactance Measurement method,
which maintains a constant accuracy within the measurement range.
Field calibration of the AGMD is not required due to the measurement method used.
 
 
Hardware Housing Size 300(±0.05)mm
Housing Material Anodized Aluminum
Weight 630g(±5g)
Thickness 9.0(±0.2)mm
Operating Pressure <10e^-6 to 760Torr
Operating Temperature 20~70℃
Battery >4hours per charge
SENSOR Accuracy 0.025mm(25㎛) within 20mm
Resolution 0.001mm(1㎛)
Measurement Range 13~20mm
Measurement Units mm, mils
Software Type View :Gap check, Auto mark function, Offset function
Review : Replay Log File, Auto report function
Operating System Windows 7, 8, 10
Wireless Link Module Wireless Communication
Others Product Components AGMD Sensor, Charging case, Link module, USB cable
Charging cable, Software, Carrying case
Calibration Manufacturer recalibration(annually)